Rad-hard 3D Integrated Circuit Design for Aerospace and Defense is Goal of Honeywell-Tezzaron Partnership

December 13, 2011

Honeywell Microelectronics and Precision Sensors in Plymouth, Minn., and Tezzaron Semiconductor in Naperville, Ill., are working together to design power-efficient three-dimensional radiation-hardened integrated circuits for aerospace and defense applications such as satellites, manned spacecraft, and high-altitude aircraft.

Click to Continue to Military and Aerospace Electronics